BSFF Thermal Paste, 11g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance
Product Details
Size Name: 11G
Brand: BSFF
MPN: BS-139
UPC: Does not apply
EAN: Does not apply
Brand: BSFF
Package Dimensions: 20.6 x 9.7 x 1.3 cm; 30 g
Item model number: BS-139
Manufacturer: BSFF
Are Batteries Included: No
Item Weight: 30 g
Guaranteed software updates until: unknown
Date First Available: 14 Dec. 2021
SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
HIGH DURABILITY: BS-139 thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
EASY TO APPLY: BS-139 thermal paste has ideal consistency and is very easy to use even for beginners
